Hyperscale
Thermal Management at Hyperscale
A hyperscaler is a technology company that operates massive data centers to deliver globally connected services, including artificial intelligence and cloud computing. Hyperscale facilities are essential for helping the world's largest AI models, search engines, and storage services. However, they face rapidly escalating compute density, performance demands, and energy requirements—challenges that far exceed the limits of traditional air cooling.
To overcome these thermal constraints, hyperscale operators are rapidly adopting liquid-cooling technologies. Mikros Technologies’ advanced direct-to-chip solutions deliver unmatched thermal resistance and flow efficiency, enabling higher compute density without breaching facility power or pressure budgets. As rack power approaches 1 megawatt (MW) and custom silicon becomes standard, our precision-engineered cold plates provide the scalability, reliability, and thermal performance needed to sustain high-density growth across AI and cloud infrastructure.
Ready to scale with efficient thermal performance?
As demand for computational power escalates in hyperscale environments, effective thermal management is paramount. High-performance liquid cooling solutions from Mikros Technologies are a vital advancement in addressing the challenges posed by rising rack power densities and custom silicon requirements.
Our commitment to providing best-in-class, tailored liquid-cooling solutions ensures that data centers can meet the rigorous demands of modern computing while prioritizing sustainability and efficiency. Hyperscale operators can confidently scale their infrastructures, enhancing performance while keeping energy costs and environmental impacts in check. Embracing liquid cooling solutions from Mikros Technologies will enable seamless growth while maintaining the integrity of mission-critical operations.
#1
Exploding Rack PowerIn today’s modern hyperscale environments, power densities are pushing 1 megawatt (MW) per rack in AI and GPU-intensive clusters. Traditional air-cooled systems cannot keep pace with this rapid surge in power density, resulting in reduced compute performance and increased energy consumption. Meanwhile, hyperscalers are deploying custom-designed chips optimized for specialized tasks such as training, inference, and neural network processing. These chips generate more waste heat and require advanced thermal control. Liquid cooling, especially direct-to-chip solutions like Mikros Technologies, effectively addresses both challenges by removing more heat per unit area directly at the source, maintaining consistent junction temperatures, and enabling greater compute density while extending hardware lifespan and performance stability.
#2
Customized SolutionsAt Mikros Technologies, we collaborate with hyperscale teams to deliver tailored cold plates engineered for specific power maps and server configurations. Each liquid cooling design can be uniquely matched to its application, ensuring optimal thermal performance and a precise mechanical fit. Our innovative microchannel cold plates deliver the highest thermal effectiveness, making them the most efficient thermal management tool for both custom and off-the-shelf high-power processors. With a focus on performance, integration, and scalability, our products are engineered to meet the demands of hyperscale environments, empowering your technology to perform at its best.
#3
Ultra-Low Thermal ResistanceOur innovative microchannel designs excel at high-heat-flux power dissipation, minimizing thermal resistance, making our technology the perfect choice for meeting the thermal demands of hyperscale infrastructure. With server rack power mapping to 1MW and hyperscalers deploying custom AI silicon in increasingly dense packaging, traditional air cooling is reaching its limits. Mikros Technologies’ cold plates provide direct, chip-level heat extraction, ensuring that AI accelerators, CPUs, and GPUs maintain safe operating temperatures, even under sustained peak loads in tightly packed server environments. Our designs not only enhance thermal performance but also increase system efficiency at scale.
#4
High Flow EfficiencyMikros Technologies cold plates are engineered to maximize heat transfer while minimizing thermal resistance. This offers our customers an increased thermal budget while allowing them to expand the compute power and footprint of their liquid cooling deployments without a significant increase in pumping power. By allowing lower coolant flow rates for the same power dissipation, our solution increases available computing power without exceeding the cooling distribution unit (CDU) pressure-drop allowances.
#5
SustainabilityAs energy costs surge and environmental, social, and governance (ESG) mandates tighten, hyperscale data center operators are embracing strategies to improve their Power Usage Effectiveness (PUE) ratio and reduce their overall environmental impact. Mikros Technologies helps meet these goals with ultra-efficient, direct-to-chip cold plates that reduce energy consumption by allowing warmer coolant inlet temperatures, reducing the need for facility chiller power, and enabling more efficient heat reuse where desired. By choosing Mikros Technologies’ best-in-class liquid cooling, you can champion sustainability while achieving tangible reductions in operational energy costs.
#6
End-to-End ScalabilityMikros Technologies provides comprehensive support —from thermal modeling through prototyping and testing to production —allowing rapid iteration and high-volume deployment without disruption. Our modular, high-performance liquid cooling solutions are customized to accommodate changes in future workloads and evolving server designs. This flexibility allows for easy expansion of thermal capacity as design needs shift. Whether you are upgrading AI clusters or deploying into new regions, Mikros Technologies ensures seamless integration that keeps up with the fast pace of compute growth. Our responsive engineering team and global manufacturing capabilities make it easy to scale custom cooling solutions.
#1
Exploding Rack PowerIn today’s modern hyperscale environments, power densities are pushing 1 megawatt (MW) per rack in AI and GPU-intensive clusters. Traditional air-cooled systems cannot keep pace with this rapid surge in power density, resulting in reduced compute performance and increased energy consumption. Meanwhile, hyperscalers are deploying custom-designed chips optimized for specialized tasks such as training, inference, and neural network processing. These chips generate more waste heat and require advanced thermal control. Liquid cooling, especially direct-to-chip solutions like Mikros Technologies, effectively addresses both challenges by removing more heat per unit area directly at the source, maintaining consistent junction temperatures, and enabling greater compute density while extending hardware lifespan and performance stability.
#2
Customized SolutionsAt Mikros Technologies, we collaborate with hyperscale teams to deliver tailored cold plates engineered for specific power maps and server configurations. Each liquid cooling design can be uniquely matched to its application, ensuring optimal thermal performance and a precise mechanical fit. Our innovative microchannel cold plates deliver the highest thermal effectiveness, making them the most efficient thermal management tool for both custom and off-the-shelf high-power processors. With a focus on performance, integration, and scalability, our products are engineered to meet the demands of hyperscale environments, empowering your technology to perform at its best.
#3
Ultra-Low Thermal ResistanceOur innovative microchannel designs excel at high-heat-flux power dissipation, minimizing thermal resistance, making our technology the perfect choice for meeting the thermal demands of hyperscale infrastructure. With server rack power mapping to 1MW and hyperscalers deploying custom AI silicon in increasingly dense packaging, traditional air cooling is reaching its limits. Mikros Technologies’ cold plates provide direct, chip-level heat extraction, ensuring that AI accelerators, CPUs, and GPUs maintain safe operating temperatures, even under sustained peak loads in tightly packed server environments. Our designs not only enhance thermal performance but also increase system efficiency at scale.
#4
High Flow EfficiencyMikros Technologies cold plates are engineered to maximize heat transfer while minimizing thermal resistance. This offers our customers an increased thermal budget while allowing them to expand the compute power and footprint of their liquid cooling deployments without a significant increase in pumping power. By allowing lower coolant flow rates for the same power dissipation, our solution increases available computing power without exceeding the cooling distribution unit (CDU) pressure-drop allowances.
#5
SustainabilityAs energy costs surge and environmental, social, and governance (ESG) mandates tighten, hyperscale data center operators are embracing strategies to improve their Power Usage Effectiveness (PUE) ratio and reduce their overall environmental impact. Mikros Technologies helps meet these goals with ultra-efficient, direct-to-chip cold plates that reduce energy consumption by allowing warmer coolant inlet temperatures, reducing the need for facility chiller power, and enabling more efficient heat reuse where desired. By choosing Mikros Technologies’ best-in-class liquid cooling, you can champion sustainability while achieving tangible reductions in operational energy costs.
#6
End-to-End ScalabilityMikros Technologies provides comprehensive support —from thermal modeling through prototyping and testing to production —allowing rapid iteration and high-volume deployment without disruption. Our modular, high-performance liquid cooling solutions are customized to accommodate changes in future workloads and evolving server designs. This flexibility allows for easy expansion of thermal capacity as design needs shift. Whether you are upgrading AI clusters or deploying into new regions, Mikros Technologies ensures seamless integration that keeps up with the fast pace of compute growth. Our responsive engineering team and global manufacturing capabilities make it easy to scale custom cooling solutions.
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